4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
Price:
₦9,400
Brand: Generic
Quantity: Qty:
In Stock
Sku:
ldhviulcwtw
Price :
9,400
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Product Description
100% Item new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

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We provide the good product with the best price,we support Wholesale/Drop Shipping Order
1. For Drop Shipping order, please remark"dropshipping order", we will prioritize it.
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Key Features

BGA Stencil
for MTK MSM
BGA Direct Heat Template
BGA Stencil for MTK MSM
4PCS Universal BGA Stencil

What's In the Box

4 x BGA Reballing Stencils

Product Specification
Model BGA Stencil
Production Country China
Size (L x W x H cm) 19.5x10x0.5
Weight (kg) 0.07
Color silver
Main Material stainless steel

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